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CPU
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2 4th Generation Intel®Xeon® Sapphire Rapids / 5th Generation Intel®Xeon® Emerald Rapids SP series
64 Cores for each Processor and 385W power consumption
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Chipset
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Intel® C741
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Memory
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32 × DDR5 RDIMMs (maximum)
Up to 5600 MT/s Data Rate, Dual-socket processor with maximum capacity of 8TB
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Storage controller
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Standard PCIe HBA Controller or Raid Controller
NVMe RAID
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FBWC
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8 GB Cache, support Supercapacitor protection
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Storage
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Support SAS/SATA/NVMe U.2/EDSFF E1.S Drives
Front 24LFF; Rear 12LFF+4LFF(2LFF)+4SFF; Support internal 4LFF or 8SFF*; Optional 18 NVMe drives*
Support 2 M.2 as boot disk
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Network
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1 x onboard 1 Gbps HDM management Ethernet port
2 x OCP3.0 Ethernet adapter support NCSI function and hot-swap
PCIe Standard Slots for 10/25/100/200Gb Ethernet Adapter or 100/200/400Gb InfiniBand card
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PCIe slots
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Up to 10 x PCIe 5.0 standard slots and 2x OCP3.0 Slots
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Ports
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2 x VGA connector (Front and Rear) and serial port
5 x USB 3.0 connectors (two at the front and two at the rear and one at the internal), 1 × Type C for HDM
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GPU
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Up to 2 double-width or 8 single-width GPUs*
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Optical drive
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External optical drive
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Management
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HDM Management System(with rear independent management Ethernet port and front dedicated Type C port)
H3C iFIST/UniSystem
U-Center data center management platform(Optional)
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Security
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Intelligent Front Security Bezel
Support Chassis Intrusion Detection
TPM2.0
2FA
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Power supply and Cooling
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1+1 Redundancy power supply
Titanium 1600W
Platinum Level 800W/1300W/1600W/2000W/2400W/2700W
-48V/336V DC power module
Hot swappable redundant Fans
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Standards
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CE CB TUV etc.
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Operating temperature
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Operating temperature: 5°C to 40°C (41°F to 104°F)
Storage Temperature：-40~85ºC(-41°F to 185°F)
The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.
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Dimensions (H × W × D)
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4U Height
Without a security bezel: 174.8 × 447 × 781 mm (6.88 × 17.60 × 30.75 in)
With a security bezel: 174.8 × 447 × 809 mm (6.88 × 17.60 × 31.85 in)
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