Computing
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2 × Intel® Xeon® Scalable processors
(Up to 28 cores and maximum 205 W power consumption)
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Memory
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3.0 TB (maximum)
24 × DDR4 DIMMs
(Up to 2933 MT/s data transfer rate and support for both RDIMM and LRDIMM)
(Up to 12 Intel ® Optane™ DC Persistent Memory Module.(DCPMM)
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Storage controller
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Embedded RAID controller (SATA RAID 0, 1, 5, and 10)
Mezzanine HBA card (SATA/SAS RAID 0, 1, and 10) (Optional)
Mezzanine storage controller (RAID 0, 1, 5, 6, 10, 50, 60, and 1E) (Optional)
Standard PCIe HBA cards and storage controllers (Optional)
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FBWC
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4 GB DDR4-2133MHz
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Storage
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Front 4LFF + rear 2SFF or front 10SFF + rear 2SFF (supports SAS/SATA HDD/SSD and up to 8 front NVMe drives)
480 GB SATA M.2 SSDs
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Network
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1 × onboard 1 Gbps management network port
1 × mLOM Ethernet adapter that provides 4 × 1GE copper ports or 2 × 10GE copper/fiber ports (Optional)
1 × PCIe Ethernet adapters (Optional)
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PCIe slots
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5 × PCIe 3.0 slots (two standard slots, one for Mezzanine storage controller, and one for Ethernet adapter)
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Ports
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Front VGA connector (Optional)
Rear VGA connector and serial port
4 × USB 3.0 connectors (two at the rear and two in the server)
2 × MicroSD slots (Optional)
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GPU
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2 × single-slot wide GPU modules
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Optical drive
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External optical drive
Only the 4LFF and 8SFF drive models support built-in optical drives
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Management
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HDM (with dedicated management port) and H3C FIST
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Power supply and ventilation
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Platinum 550W/800W/850W or 800W –48V DC power supplies (1+1 redundancy)
Hot swappable fans (supports redundancy)
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Standards
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CE,UL , FCC,VCCI,EAC, etc.
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Operating temperature
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5°C to 45°C (41°F to 113°F)
The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.
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Dimensions (H × W × D)
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Without a security bezel: 42.88 × 434.59 × 768.3 mm (1.69 × 17.11 × 30.25 in)
With a security bezel: 42.88 × 434.59 × 780.02 mm (1.69 × 17.11 × 30.71 in)
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