Detailed Specification
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CPU
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2 x 3rd generation Intel® Xeon® Ice Lake SP series
(each processor up to 40 cores and maximum 270W power consumption)
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Chipset
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Intel® C621A
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Memory
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32 x DDR4 DIMM slots , maximum 6.0 TB
Up to 3200 MT/s data transfer rate RDIMM
Up to 16 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass)
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Storage controller
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Embedded RAID controller
Standard PCIe HBA cards and storage controllers,depending on model
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FBWC
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8 GB DDR4 cache, depending on model ,support supercapacitor protection
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Storage
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Up to Front 4LFF bays, Rear 2SFF bays*
Up to Front 10SFF bays, Rear 2SFF bays*
Front SAS/SATA HDD/SSD/NMVe Drives, maximum 8 x U.2 NVMe Drives
SATA/PCIe M.2 SSDs,2 x SD card kit , depending on model
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Network
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1 x onboard 1 Gbps management network port
1 x OCP 3.0 slot for 4 x 1GE or 2 x 10GE or 2 x 25GE NIC
PCIe Standard slots for 1/10/25/40/100GE/IB Ethernet adapter,
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PCIe slots
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4 x PCIe 4.0 standard slots
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Ports
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VGA connectors (Front and Rear) and serial port (RJ-45)
5 x USB 3.0 ports (1 front, 2 rear, and 2 internal)
1 dedicated management Type-C port
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GPU
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4 x single-slot wide GPU modules
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Optical drive
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External optical disk drive,optional
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Management
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HDM OOB system (with dedicated management port) and H3C iFIST/FIST, support LCD touchable smart model
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Security
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Intelligent Front Security Bezel *
Chassis Intrusion Detection
TPM2.0
Silicon Root of Trust
2FA for HDM
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Power supply
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2 x Platinum 550W/800W/850W/1300W/1600W (1+1 redundancy) ,depending on model
800W –48V DC power supply (1+1 Redundancy)
Hot swappable redundant fans
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Standards
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CE,UL , FCC,VCCI,EAC, etc.
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Operating temperature
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5°C to 45°C (41°F to 113°F)
The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.
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Dimensions (H × W × D)
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1U Height
Without a security bezel: 42.9 x 434.6 x 780 mm (1.69 x 17.11 x 30.71 in)
With a security bezel: 42.9 x 434.6 x 808 mm (1.69 x 17.11 x 31.81 in)
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