CPU
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2 x 3rd generation Intel® Xeon® Ice Lake SP series
(each processor up to 40 cores and maximum 270W power consumption)
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Chipset
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Intel® C621A
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Memory
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32 x DDR4 DIMM slots , maximum 6.0 TB
Up to 3200 MT/s data transfer rate RDIMM
Up to 16 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass)
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Storage controller
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Embedded RAID controller
Standard PCIe HBA controller or storage controller, depending on model
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FBWC
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8 GB DDR4 cache, depending on model, support supercapacitor protection
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Storage
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Up to front 12LFF bays, Rear 4LFF/4SFF bays
Up to front 25SFF bays, Rear 4LFF/4SFF bays
Front/Rear SAS/SATA HDD/SSD NVMe Drives, maximum 24 x U.2 NVMe Drives
SATA or PCIe M.2 SSDs, 2 x SD card kit , depending on model
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Network
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1 x onboard 1 Gbps management network port
2 x OCP 3.0(x16)slots for 4 x 1GE or 2 x 10GE or 2 x 25GE NICs
PCIe Standard slots for 1/10/25/40/100/200GE/IB Ethernet adapter
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PCIe slots
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14 x PCIe 4.0 standard slots, depending on model
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Ports
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VGA ports (Front and Rear) and serial port (RJ-45)
6 x USB 3.0 ports (2 front, 2 rear, 2 internal)
1 dedicated management Type-C port
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GPU
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14 x single-slot wide or 4 x double-slot wide GPU modules, depending on model
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Optical drive
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External optical disk drive , optional
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Management
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HDM OOB system (with dedicated management port) and H3C iFIST/FIST, LCD touchable smart model
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Security
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Intelligent Front Security Bezel
Chassis Intrusion Detection
TPM2.0
Silicon Root of Trust
2FA for HDM
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Power supply
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2 x Platinum 550W/800W/850W/1300W/1600W/2000/2400W (1+1 redundancy) , depending on model
800W –48V DC power supply (1+1 Redundancy)
Hot swappable redundant fans
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Standards
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CE,UL , FCC,VCCI,EAC, etc.
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Operating temperature
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5°C to 45°C (41°F to 113°F)
The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.
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Dimensions (H × W × D)
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2U Height
Without a security bezel: 87.5 x 445.4 x 748 mm (3.44 x 17.54 x 29.45 in)
With a security bezel: 87.5 x 445.4 x 776 mm (3.44 x 17.54 x 30.55 in)
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