Detailed Specification
|
CPU
|
2 4th Generation Intel®Xeon® Sapphire Rapids / 5th Generation Intel®Xeon® Emerald Rapids SP series
64 Cores for each Processor and 385W power consumption
HBM technology
|
Chipset
|
Intel®C741
|
Memory
|
32 DDR5 RDIMM Slots, 5600 MT/s Data Rate, 8TB on 2 CPU Configuration with 256G DDR5 RDIMM
|
Raid Controller
|
Dedicated PCIe HBA Controller or Raid Controller*
Standard PCIe HBA Controller or Raid Controller
|
FBWC
|
8 GB Cache, support Supercapacitor protection
|
Storage
|
Front 10SFF bays, Rear 2SFF bays
Front 4LFF bays
SAS/SATA HDD/SSD Drives,12 U.2 NVMe Drives
SATA/NVMe M.2 Kit, DSD module (2 x SD card kit)
|
Network
|
1 Onboard 1Gbps Management Network Port
2 Onboard OCP 3.0 Slots for 4 GE or 2 10GE or 2 25GE or 2 100GE NICs
PCIe Standard Slots for 1/10/25/100GE Ethernet Adapter, IB card
|
Expansion Slots
|
4 PCIe Standard Slots (3 PCIe5.0 and 1 PCIe4.0) and 2 Onboard OCP 3.0 Slots;
CXL1.1
|
Ports
|
Standard: 2 VGA Port (1 Front, 1 Rear), 3 USB 3.0 Ports (1 Front, 2 Rear), 1 USB 2.0 Internal Port, 1 Front Type-C port
Optional: 1 Rear Management Port
|
GPU
|
4 Single-Slot GPU Modules
|
Optical Drive
|
External Optical Disk Drive, Optional
|
Management
|
HDM Management System (with dedicated management port)
H3C iFIST/UniSystem, LCD touchable model,64M Video Cache
|
Security
|
Intelligent Front Security Bezel *
Chassis Intrusion Detection
TPM2.0
Silicon Root of Trust
2FA for HDM
Intel SGX2.0 and PFR3.0
|
Power supply
|
1+1 Redundancy power supply
Titanium 1600W
Platinum 800W/1300W/1600W/2000W
DC power supply
8 Hot swappable Redundant Fans
|
Standards
|
CE,UL , FCC,VCCI,CB, etc.
|
Operating temperature
|
5°C to 45°C (41°F to 113°F) *
|
Dimensions (H × W × D)
|
1U Height
Without a security bezel: 42.9 x 434.6 x 777 mm (1.68 x 17.11 x 30.59 in)
With a security bezel: 42.9 x 434.6 x 805 mm (1.68 x 17.11 x 31.7 in)
|